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主 要 功 能
- Up to 1.25Gb/s bi-directional data links.
- Hot-pluggable SFP footprint.
- Extended cased temperature range(0°C to +70 °C).
- Fully metallic enclosure for low EMI.
- Low power dissipation (1.05 W typical).
- Compact RJ-45 connector assembly.
- Access to physical layer IC via 2-wire serial bus.
- 1000 BASE-T operation in host systems with SERDES interface.
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